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Backplane system having high-density electrical connectors

Invented by: Stanford W. Crane, Jr.
Boca Raton, FL

Originally Assigned to: Silicon Bandwith Inc.
San Jose, CA
[Now assigned to . . .]

Issued:2006-09-05
Filed:2003-04-01
Application No:10402962
Examined by:Knight; Anthony

A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.

[pdf] U.S. Pat. No. 7,103,753

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