An adapter module is provided with a bail latch mechanism that serves to engage and disengage the frame into which the adapter module fits. The bail latch is movable between two positions and it engages a cam member formed as part of the module that cams two opposing free ends of the bail latch inwardly into the module to thereby release it from the adapter frame. The adapter frame includes a wear sleeve that cams the bail latch free ends inwardly during some insertions of the module. C-shaped press fit pins are made with the adapter frame for better engagement with the circuit board.