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BOCA PATENTS BY
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Method and apparatus for dissipating heat from an integrated circuit

Invented by: Justin R. Wodrich
Plantation, FL

Michael S. Beard
Boca Raton, FL

Hal R. Canter
Weston, FL

Anbuselvan Kuppusamy
Plantation, FL

Zalman Schwartzman
Rehovot, IL

James L. Stephens
Pembroke Pines, FL

Kathleen Farrell, legal representative
Wellington, FL

Kevin C. Farrell
Wellington, FL

Originally Assigned to: Motorola, Inc.
Schaumburg, IL
[Now assigned to . . .]

Issued:2009-04-21
Filed:2006-03-08
Application No:11370631
Examined by:Nguyen; Cuong Q

An apparatus (100) is provided for dispersing heat from an integrated circuit (202) to a heat sink (404). The apparatus (100) is formed on a nonconductive body (102) having at least two conductive surfaces (110, 112) disposed thereon. One of the conductive surfaces (110) is reflowed to a heat generating lead of the integrated circuit (202), and the other conductive surface (112) provides a surface for contacting a heat sink (404). The apparatus (100) and integrated circuit provide a package (200) which can be tape and reeled (300) for easy mounting to a printed circuit board (402) of a communication device (400).

[pdf] U.S. Pat. No. 7,521,791

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