A sealing system for sealing a component (102) within an electronic device (100) is provided. The system includes one or more apertures (206) within an internal housing (202). Further the system includes an adhesive (602), adhered on a first surface to a ledge (502) and bottom perimeter surface 402 of the component. Furthermore, the system includes an external housing (204). The external housing presses the perimeter of the component onto the ledge.